Farrens, Shari : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (13)
Les plus populaires
Liste
- Liste
- Tableau

1

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding

Huyghebaert, Cedric, Van Olmen, Jan, Civale, Yann, Phommahaxay, Alain, Jourdain, Anne, Sood, Sumant, Farrens, Shari, Soussan, Philippe

Année:

2010

Langue:

english

Fichier:

PDF, 236 KB

english, 2010

2

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging

Sood, Sumant, Farrens, Shari, Pinker, Ron, Xie, James, Cataby, Wilbur

Année:

2010

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2010

3

Chemical Free Room Temperature Wafer To Wafer Direct Bonding

Farrens, Shari N.

Journal:

Journal of The Electrochemical Society

Année:

1995

Langue:

english

Fichier:

PDF, 1.94 MB

english, 1995

4

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Thin Wafer Handling Challenges and Emerging Solutions

Farrens, Shari N., Bisson, Peter, Sood, Sumant, Hermanowski, James

Année:

2010

Langue:

english

Fichier:

PDF, 360 KB

english, 2010

5

[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies

Farrens, Shari N., Gabriel, Markus

Année:

2006

Langue:

english

Fichier:

PDF, 329 KB

english, 2006

6

Vertical Integration: A Confederacy of Alignment, Bonding, and Materials Technologies

Journal:

MRS Proceedings

Année:

2006

Langue:

english

Fichier:

PDF, 501 KB

english, 2006

7

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Low Temperture Au-Au Thermal Compression Bonding of Thermally Mismatched Substrates

Farrens, Shari, Sood, Sumant

Année:

2008

Langue:

english

Fichier:

PDF, 743 KB

english, 2008

8

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Permanent Bonding with Polymers

Farrens, Shari, Sood, Sumant, Ishida, Hiroyuki

Année:

2008

Langue:

english

Fichier:

PDF, 472 KB

english, 2008

9

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Metal Surface Preparation for Wafer Bonding with Point of Use Wet Chemistries

Sood, Sumant, Farrens, Shari, Rardin, Anthony, Kirk, Simon, Pettit, Dave

Année:

2010

Langue:

english

Fichier:

PDF, 868 KB

english, 2010

10

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Evolution of bond technology to hybridized process flows

Année:

2009

Langue:

english

Fichier:

PDF, 591 KB

english, 2009

11

Atomic-Layer Cleaving and Non-contact Thinning and Thickening for Fabrication of Laminated Electronic and Photonic Materials

Current, Michael I., Farrens, Shari N., Fuerfanger, Martin, Kang, Sien, Kirk, Harry R., Malik, Igor J., Feng, Lucia, Henley, Francois J.

Journal:

MRS Proceedings

Année:

2001

Langue:

english

Fichier:

PDF, 718 KB

english, 2001

12

SPIE Proceedings [SPIE Optical Science and Technology, SPIE's 48th Annual Meeting - San Diego, CA (Sunday 3 August 2003)] Gradient Index, Miniature, and Diffractive Optical Systems III - Beginning-to-end wafer bonding for advanced optical systems

Farrens, Shari N., Lindner, Paul, Dwyer, Steven, Wimplinger, Markus, Suleski, Thomas J.

Année:

2003

Langue:

english

Fichier:

PDF, 772 KB

english, 2003

13

SPIE Proceedings [SPIE MOEMS-MEMS Micro & Nanofabrication - San Jose, CA (Saturday 22 January 2005)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV - Packaging methods and techniques for MOEMS and MEMS

Farrens, Shari N., Tanner, Danelle M., Ramesham, Rajeshuni

Année:

2005

Langue:

english

Fichier:

PDF, 560 KB

english, 2005